QUECTEL System-on-Modules (SoM) with LTE Cat 4 +++ Computer-on-Modules Made Easy +++ Double-Locking for Superior Sealing
Computer-on-Modules Made Easy:
Integrating a Powerful 64-bit STM32MP2 on a 2-Layer Baseboard

Maximum performance, flexibility and easy integration
With the new generation of STM32MP2 modules, manufacturer Ka-Ro is setting new standards in embedded technology. These powerful modules offer developers a state-of-the-art 64-bit platform based on a CoM module, which is available in various form factors.
These include the compact QS solder module measuring just 29 x 29 mm² and a height of just 2.6 mm. The modules are ideal for applications that require both high computing power and a compact design.
Three key advantages for the user:
- Powerful multi-core architecture with AI support
The STM32MP2 processor integrates two Cortex®-A35 CPU cores clocked at up to 1.5 GHz and an additional Cortex-M33 with up to 400 MHz. The integrated Neural Processing Unit (NPU) delivers an impressive 1.35 TOPS, which is particularly important for AI-intensive applications. In addition, the integrated 3D GPU and VPU enable smooth graphics and video processing. This multi-core architecture offers the perfect balance of performance and energy efficiency to handle complex tasks quickly and efficiently. - Maximum flexibility and scalability
Ka-Ro modules are characterised by exceptional flexibility and scalability. Thanks to the pin- and function-compatible design, users can easily replace modules and upgrade to the next performance class without changing their existing hardware. This saves development time and costs and enables faster time-to-market. Support for parallel and LVDS displays up to 1080p as well as comprehensive connectivity options such as Gigabit Ethernet and USB 3.0 also offer a wide range of possible uses in various applications. - Simple integration and high reliability
Ka-Ro's innovative QA concept enables simple integration on a 2-layer base board, eliminating the need for complex and costly multi-layer layouts. Direct soldering increases operational reliability in harsh environments. Costs are also saved as board-to-board connectors can be dispensed with and the modules can be assembled and soldered automatically. The optimised pinout and the central GND pad ensure improved signal quality and greater reliability. Thanks to the QFN solder joints, quick and easy visual inspection is possible, which speeds up the production process and increases operational reliability.
QSM2-2550

TXMP-2550

The soldering module is also available as a plug-in module variant:
QSM2-2550 | TXMP-2550 |
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Conclusion:
With Ka-Ro's new STM32MP2 module generation, you are ideally equipped to realise your projects more efficiently and successfully. Benefit from outstanding performance, flexible scalability and simple integration - for a future-proof solution that impresses in every area of application. A little tip: Start your development with GLYN-SUPPORT...