MCU System or Better Computer-on-Modules? +++ SoC with Wi-Fi 6 and BLE 5.4 +++ 4 GB eMMC™ in a New Small BGA Package
MCU System or Better Computer-on-Modules?
Why It's Worth Switching to Solderable CoM Modules
Applications increasingly demand more performance!
For instance, in industrial control systems, Computer-on-Modules with LINUX operating systems are increasingly replacing traditional microcontrollers. These provide the necessary flexibility and computing power to control complex processes, drive displays, process large amounts of data, and integrate complex external hardware.
Computer-on-Modules or Microcontrollers
The choice between a LINUX-based Computer on Module and a microcontroller system primarily depends on the specific project requirements. There are many compelling reasons for a sensible transition:
- Easy control of displays (TFT - HMI)
- Extensive Ethernet connectivity (IoT applications)
- Direct connection of complex external hardware (camera, Bluetooth, WLAN)
- Compute-intensive applications
- Processing large amounts of data (images/videos)
- Security aspects
New KA-RO CoM Facilitates
Entry Ideal for beginners or those switching, KA-RO offers the QSMP-1351 module based on the STM32MP135C. It offers high computing power, low energy consumption, and security features such as Secure Boot at a very attractive price.
The QSMP-1351 also features a 24-bit LCD-TFT interface, Gigabit Ethernet, USB 2.0, CAN, as well as numerous serial interfaces. It provides 256 MByte of RAM and 4 GByte of eMMC storage. The new module comes in an ultra-small QFN-100 package, measuring 27 mm x 27 mm with a height of just 2.3 mm.
Advantage of Secure Contacting
The manufacturer's QS concept allows for the use of a simple 2-layer base card, eliminating the need for expensive multi-layer PCB layouts. Thanks to QFN solder joints, there is no need for time-consuming X-ray inspection of contacts, as would be necessary with BGA packages. A quick visual inspection is completely sufficient. All pins are easily accessible for measurement.
Direct soldering increases operational reliability in harsh environments. Complex board-to-board connectors can be eliminated. The modules are automatically assembled and soldered. You can start series production immediately.
Single-Sided Design Simplifies
Integration There are no connections under the package - only the central GND pad! The optimized pinout is designed to allow direct connections without crossing traces.
Scalable Performance thanks to Pin-Compatible Concept
For quick upgrades in computing power, numerous pin-compatible modules are available. The new KA-RO QS standard includes all major interfaces, including USB, Gigabit Ethernet, and many serial interfaces. The modules only require a 3.3 V power supply for operation.
100-Pin QFN
- Processor STM32MP135
- Arm® Cortex®-A7 650MHz
- RAM 256 MByte DDR3L
- ROM 4 GByte eMMC
- 27 x 27 x 2.3 mm with 1 mm pitch
- Single Power Supply
- Industrial Rated
- Long-Term Availability (12 years)
Standard Interfaces:
- 24-bit RGB
- Gigabit Ethernet
- USB 2.0
- SD / eMMC Flash Interface
- CAN
- UART / I2C / SPI / PWM / SAI
Overview of KA-RO solderable modules of the QS family:
|
Part Nr. |
Processor |
Cores |
Clock |
RAM |
ROM |
Operating Temp |
USB |
Ether |
UART |
I2C |
SPI |
CAN |
SD/ |
Serial Audio |
PCIe |
GPU |
VPU |
NPU |
LCD- |
|
QSMP-1351 |
STM32MP135C |
1xA7 |
650 MHz |
256 MB |
4 GB |
-25 to 85 °C |
2 |
1 |
8 |
√ |
√ |
2 |
1 |
1 |
- |
- |
- |
- |
24bit |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
QSMP-1530C |
STM32MP157C |
2xA7 |
650 MHz |
256 MB |
4 GB |
-25 to 85 °C |
2 |
1 |
8 |
√ |
√ |
2 |
1 |
1 |
- |
√ |
- |
- |
24bit + MIPI |
|
QSMP-1570 |
STM32MP157C |
2xA7 |
650 MHz |
512 MB |
4 GB |
-25 to 85 °C |
2 |
1 |
8 |
√ |
√ |
2 |
1 |
1 |
- |
√ |
- |
- |
24bit + MIPI |
|
QSRZ-G2L1 |
Renesas RZ/G2L |
2xA55 |
1.2 GHz |
512 MB |
4 GB |
-40 to 85 °C |
2 |
1 |
4 |
√ |
√ |
2 |
1 |
1 |
- |
√ |
√ |
- |
24bit + MIPI |
|
QSRZ-G2L0 |
Renesas RZ/G2L |
2xA55 |
1.2 GHz |
1 GB |
4 GB |
-40 to 85 °C |
2 |
1 |
4 |
√ |
√ |
2 |
1 |
1 |
- |
√ |
√ |
- |
24bit + MIPI |
|
QS93-5210 |
NXP IMX93 |
2xA55 |
1.5 GHz |
1 GB |
4 GB |
-40 to 85 °C |
2 |
2 |
8 |
√ |
√ |
2 |
2 |
1 |
- |
√* |
- |
- |
LVDS + MIPI |
|
QS8M-ND00 |
NXP IMX8M Nano |
2xA53 |
1.6 GHz |
512 MB |
4 GB |
-25 to 85 °C |
1 |
1 |
4 |
√ |
√ |
- |
1 |
1 |
- |
√ |
√ |
- |
MIPI |
|
QS8M-MQ00 |
NXP IMX8M Mini |
4xA53 |
1.6 GHz |
1 GB |
4 GB |
-25 to 85 °C |
2 |
1 |
4 |
√ |
√ |
- |
1 |
1 |
- |
√ |
√ |
- |
MIPI |
|
QSXM-MM60 |
NXP IMX8M Mini |
4xA53 |
1.6 GHz |
2 GB |
4 GB |
-25 to 85 °C |
2 |
1 |
4 |
√ |
√ |
- |
1 |
1 |
√ |
√ |
√ |
- |
MIPI |
|
QSXP-ML81 |
NXP IMX8M Plus |
4xA53 |
1.6 GHz |
2 GB |
8 GB |
-25 to 85 °C |
2 |
1 |
4 |
√ |
√ |
2 |
1 |
1 |
√ |
√ |
√ |
√ |
MIPI |
* (Blending/Composition, Resize, Color Space Conversion)
Our GLYN-SUPPORT offering for you:
Fast Start with Evaluation Kit
We enable your quick start with evaluation kits. These also serve as a reference for the series. Test for yourself how easy it is to design a baseboard using the QS family. A simple two-layer PCB was sufficient to implement the board with the QSMP-1531 module.
Easy Connection of TFTs from the Family Concept
The displays from GLYN and EDT's TFT family concept can be easily connected to the evaluation kit. Thanks to a uniform interface, you can comfortably interchange displays ranging from 3.5" to 7" with each other.
Double-layered board with QSMP-1351
256 MByte RAM
4 GByte eMMC
GB Ethernet
Board dimensions: 60mm x 90mm
QSMP dimensions: 27mm x 27mm x 2.3mm
Order designation: QSMP-SV35
You can order the STM32MP1-based evaluation kits at a low price of €109* from us, under the designation QSMP-SV35.
Begin your development with the GLYN-SUPPORT offer now.
*Price per unit excluding VAT and shipping.