Be careful, or You Will Miss Out on Normality +++ CoM Soldering Modules: Smaller, Faster, and Cheaper +++ Exemplary Accurate Flow Measurement
Smaller, Faster, and Cheaper:
CoM Soldering Modules - the 'Smart' Alternative to Classic MCU Circuits
The need for advanced communication interfaces such as Ethernet, USB or PCIe and the growing integration of TFTs call for a future-proof solution.
In a world where modern applications are becoming ever more demanding, powerful microprocessor boards are replacing and supplementing conventional microcontroller circuits. The use of processors places high demands on hardware design, production and software development.
CoM solder modules offer the perfect solution here:
- Design simplification:
With CoM solder modules, you can significantly simplify complex designs and still fulfil the requirements of modern applications with ease. - Fast time to market:
Design and manufacture your own baseboard in the shortest possible time without sacrificing functionality or quality. - Extensive software support:
Benefit from a comprehensive Board Support Package (BSP) that makes software development easier and saves you valuable time.
Proprietary approach or soldering module standard
With the manufacturers ADVANTECH and KA-RO, we have two manufacturers for soldering modules in all performance classes in our product range.
KA-RO relies on a very compact QFN form factor (27 x 27 mm²).
A major advantage of this design is that all connections can be easily reached with a measuring tip. A quick visual inspection is possible and is completely sufficient.
Our partner ADVANTECH relies on the OSM (Open Standard Module) soldering module standard.
OSM modules follow a standardised design, which facilitates cooperation between different manufacturers and developers. This makes it easier for you to integrate and customise modules in different products.
The openness of the standard means that different manufacturers can offer OSM-compatible modules. This results in a large selection of modules that can be used for a wide range of applications.
Soldering saves space, heat and money
As the solder module combines all the essential functional units on one module, the designer can concentrate on the application-specific carrier board.
The core units of a module include the processor, RAM, programme memory (flash) and power management. This core design is extremely complex and can only be realised on multilayer PCBs with more than 10 layers.
The carrier board to be developed, on the other hand, can be created using simple 2 to 4-layer technology. In addition to the solder module, it contains all other necessary components, such as power supply components, connectors and necessary peripheral components.
Less space required in terms of height and surface area
By eliminating the need for a plug connector, the solder module saves a significant amount of height and space. Direct contact with the carrier board results in considerably less heat generation, so that you can generally dispense with an extra heat sink. Together with the more efficient production of such modules, you save money.
Direct soldering ensures operational reliability
Direct soldering also increases operational reliability in harsh environments. The modules can be assembled and soldered automatically. This means that the modules do not have to be inserted or screwed together manually - saving even more time and reducing costs.
Get started quickly with evaluation kits
Evaluation kits offer a quick introduction to the world of solderable CoM modules. They also serve as a reference application and show how easy it can be to design a baseboard using solderable modules.
Conclusion
Design simplification, fast time-to-market and software support.
Solderable CoM modules are used in applications that require high computing power, must be very compact and demand high mechanical stability.
They are easy to assemble by machine - ideal for large series production.
You can quickly get started with the technology using low-cost evaluation kits.
Rely on CoM solder modules combined with GLYN-SUPPORT and master the challenges of modern hardware designs more efficiently than ever before.