OSM standard for embedded computing resolution modules +++ 5.7 inch offspring for the new TFT family concept +++ GENE boards in compact packages
Strong demand:
ADVANTECH supports OSM standard for embedded computing solder modules
The term "OSM" stands for "Open Standard Module" or "Open Source Module" in the context of embedded computing and electronics.
It is an approach that uses an open standard for the development and integration of solder modules in electronic devices. Here, standards primarily mean flexibility, security and constant innovation at the cutting edge of technology.
- What exactly does the new OSM standard offer you?
- How does it benefit you in the development of your projects?
We have compiled the 5 most important points here for you...
Equipped for durability - VGA resolution and TTL-RGB interface:
5.7-inch offspring for the new TFT family concept
Designed for use in extreme environments:
Experience the future of display technology with the brand new 5.7-inch TFT display from our renowned TFT family.
VGA resolution lets you experience your content with unprecedented clarity. The integrated TTL-RGB interface allows a seamless connection to your technology. This ensures an impressive visual experience in industrial applications.
"GENE in the Box":
GENE Boards from AAEON in Compact Enclosures
You already know the 3.5" GENE boards from AAEON in use?
And you would like to pack them into an enclosure?
Then the GENESYS systems are exactly the right products for you.
They are available in selected versions and performance classes, from entry-level variants based on Intel ATOM to high-performance Core-i variants.
What they all have in common is their "simple" design. This structure allows you quick access to internal interfaces as well as numerous customization options.
Up to 600 mA output current:
For efficient power supply in IoT applications
Ideal for your developments in the field of mobile, portable battery or battery-powered applications:
With an input voltage range of 2.5 V to 5.5 V, the SGM6027 power management IC from SG MICRO is a real powerhouse in a compact format. The SGM6027 is tiny, but its performance is gigantic at the same time. Its space-saving 0.8 × 1.6 mm 8-ball BGA package (WLCSP-0.8⋅1.6-8B) delivers output currents of up to 600 mA (1310 mAp) with maximum efficiency.
GLYN-Talk - Topic of the month:
With the Multi-Wireless Modem/Gateway into the Cloud
How do you securely integrate your products into an IoT environment?
You can find the answer to this question in our GLYN Talk WIR-004.
Digitization is more significant than ever. The demand for products for the Internet of Things (IoT) has never been so high. In fact, demand is set to rise steadily over the next few years. Do you want to ride the wave of digitalization and securely integrate your products into the IoT and your cloud? With the right Pinnacle™ 100 modem and the Sentrius™ MG100 gateway from LAIRD CONNECTIVITY, you can quickly and conveniently develop a complete IoT cloud solution.