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Here FUNKS a true LAIRDmeister!
Powerful System-on-Module with worldwide certification

The Summit SOM 8M Plus is based on the NXP i.MX 8M Plus processor, as well as the 88W8997 radio chip

Really "funky" this module:

i.MX 8M Plus with Dual-Band 2x2 Wi-Fi 5 + Bluetooth 5.3 SoM + Summit™ Stack.

Integrating devices into a Wi-Fi/WLAN environment is very demanding, complex and ties up development capacity. LAIRD Connectivity's HW/SW Bundle solves these challenges in all application areas - quickly, securely and robustly.

Reliable communication with worldwide certification, that was the focus for the manufacturer's development engineers. And the result is functionality!

The Summit SOM 8M Plus is based on the NXP i.MX 8M Plus processor, as well as the 88W8997 radio chip. It simplifies and optimizes the implementation of devices/applications in a Wi-Fi/WLAN environment. The key feature is the System-on-Module together with the SummitTM Stack software. With this stack you get firmware, drivers and security functions included.

Compared to other manufacturers' Wi-Fi/WLAN system-on-modules, this bundle technically establishes a radio connection in a Wi-Fi/WLAN environment up to 15 times faster. This ensures a faster time-to-market for your device.

Ideal application areas:

Powerful heterogeneous multiprocessing

1.6 GHz quad-core Cortex-A53 microprocessor and 800 MHz Cortex-M7 microcontroller allow Linux and an RTOS to run on dedicated subsystems enclosed by the hardware.
Dedicated machine learning High-performance machine learning via an integrated neural processing unit that delivers up to 2.3 TOPS.
Variety of hardware interfaces Wide range of display, network, data, audio and camera interfaces
Virtualization The quad-core MPU can run multiple Linux instances with firewall, i.e. separate instances for user interface, connectivity and others.
Secure and encrypted booting Robust, secure and optionally encrypted boot mechanism that ensures only the intended software boots on your device.
Extended DVK Reference designs for display, camera, audio, LTE, GPS, power consumption profiling, PoE, battery usage, battery charging, USB 3.0 power, and integration of a Bluetooth 5.2 module that supports LE-coded/Long Range.

The module has 2x2 WiFi 5 (802.11ac) functionality with MIMO and supports the latest WPA3. Due to the Bluetooth 5.3 Classic BT & Bluetooth LE module incl. 2MPHY, the SOM8 has the latest wireless protocols.

The Summit SOM is available in various memory variants, so you have a wide selection to choose from.

If energy saving is important, the module has some options: NXP PMICs, power consumption optimized LPDDR4 and eMMC memory. Core shutdown, clock/voltage scaling, power-saving interfaces, and power-optimized single-stream Wi-Fi mode enable highly optimized power consumption.

Long-term availability
Particularly forward-looking is the full product lifecycle with future requirements. Devices can be upgraded in the field and the hardware is also available in the long term. The modules are Pin2Pin compatible, allowing for the use of future Summit SOM8M Plus modules.


Technical data:






4 x Cortex®-A53 cores @ 1.6 GHz



1 x Cortex®-M7 core @ 800 MHz



Tensilica® HiFi 4 DSP



GC7000UL mit 2 Shaders für 3D und GC520L für 2D



Up to 2 GB LPDDR4 Standard; Up to 6 GB LPDDR4 auf Anfrage



Up to 16 GB eMMC 5.1 standard; Up to 64 GB eMMC 5.1 auf Anfrage

Machine learning

Neural Processing Unit

  • Keyword detection, noise reduction, beamforming
  • Speech recognition (e.g. Deep Speech 2)
  • Image detection (e.g. ResNet-50)

Graphic / Video


  • 166 million triangles/sec
  • 1.0 giga pixel/sec
  • 16 GFLOPs 32-bit
  • OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan 2D Acceleration


Video Decoder

  • 1080p60 HEVC/H.265 Main, Main 10 (bis Level 5.1)
  • 1080p60 VP9 Profile 0, 2
  • 1080p60 VP8
  • 1080p60 AVC/H.264 Baseline, Main, High decoder


Video Encoder

  • 1080p60 AVC/H.264 encoder
  • 1080p60 HEVC/H.265 encoder


Display Interface

  • 1x MIPI DSI, bis zu UWHD and WUXGA
  • 1x LVDS Tx, bis zu 1920 x 1080p60
  • 1x HDMI 2.0a Tx, up to 4kp30



2 x 4-lane MIPI CSI



  • SPDIF Input and output
  • Sechs externe SAI Module for I2S, AC97, TDM,
  • Codec/DSP, and DSD Interface
  • ASRC
  • 8-Kanal PDM Microphone Input



  • 2 x USB 3.0/2.0 Dual-Role mit PHY
  • 2 x Gbit Ethernet with IEEE® 1588, AVB (Einer TSN)
  • 2 x CAN/CAN FD
  • 4 x UART 5 Mbit/s
  • 6 x I2C
  • 3 x SPI
  • 1 x SDIO 3.0/eMMC 5.1


Let's talk about your Wi-Fi/WLAN projects.

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