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For New and Redesigns in Allocation Times: Computer-on-Modules from Ka-Ro!

Computer-on-Module from Ka-Ro

You are probably familiar with these or similar challenges:
Finding the right computer-on-module for new and redesigns in allocation times is difficult.

Due to rising prices and delivery times, there is currently a lack of alternatives.

The German manufacturer Ka-Ro has developed a module concept that offers available alternatives from SO-DIMM to solder modules.

Two new modules are the beginning
These are two modules from the TX-SODIMM series and two from the QS solder module series. All modules use the Renesas RZ/G2L microprocessor. This contains two Cortex®-A55 CPU cores that can be clocked at up to 1.2 GHz. The A-55 CPU achieves about 20% better processing performance at the same frequency compared to the A53 CPU.

ARM graphics engine and MIPI interface integrated
ARM's Mali-G31 graphics engine is on the processor for graphics display, as well as a video codec (H.264). As a display interface, the modules have a MIPI DSI (4 lanes) interface and, in contrast to many other new processors, also a 24-bit parallel interface. This makes a processor of this performance class special, because especially in the field of industrial displays up to 7 inches, the parallel RGB interface is standard.

Additional Cortex®-M33 CPU core for real-time applications
The RZ/G2L used on the TXRZ module also has an additional Cortex®-M33 core that can handle classic microcontroller tasks such as real-time processing. This eliminates the need for an external microcontroller and reduces the overall cost of the system. Other highlights on the module: 2 x Gbit Ethernet, 2 × CAN (CAN-FD), 2× USB2.0 (host, host/peripheral).

Scalable with predictable long-term availability
Exceptional scalability, comprehensive long-term availability and a wide range of peripheral options have helped TX Series products gain broad acceptance in a wide variety of market segments. Renesas-based modules are designed for at least ten years of availability.

Flexible interchangeability
Ka-Ro's pin- and function-compatible modules give you tremendous flexibility.
Simply exchange them - works upwards as well as downwards compatible. Matching starter kits ensure fast time-to-market.

The technical features of DIMM and solder module at a glance:

 

TXRZ-G2L0

TXRZ-G2L1

QSRZ-G2L0

QSRZ-G2L1

Prozessor

RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55

Co-Prozessor

200 MHz ARM® Cortex®-M33 Core 

GPU

500-MHz ARM® Mali™-G31

Temperature

-40°C bis 85°C

Size

68 x 26 x 4 mm

27 x 27 x 2.7 mm

Power Supply

3,3 V bis 5 V

3,3 V

RAM

1 GB

512 MB

1 GB

512 MB

ROM

4 GB eMMC

4 GB eMMC

4 GB eMMC

4 GB eMMC

H.264 Video Codec Processor

24bit-RGB display interface

MIPI-DSI display interface

10/100Mbps Ethernet

1

1

-

-

GB Ethernet RGMII

1

1

1

1

USB

2

2

2

2

UART

4

4

3

3

I²C

4

4

3

3

SPI

3

3

2

2

CAN FD

2

2

2

2

MIPI-CSI Camera Interface

1

1

-

-

SD – Secure Digital Interface

2

2

1

1

Serial Audio Port

2

2

1

1

Security

Secure Boot, True RNG, Crypto Engine, JTAG Disable,
Device Unique ID

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