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For New and Redesigns in Allocation Times: Computer-on-Modules from Ka-Ro!

You are probably familiar with these or similar challenges:
Finding the right computer-on-module for new and redesigns in allocation times is difficult.
Due to rising prices and delivery times, there is currently a lack of alternatives.
The German manufacturer Ka-Ro has developed a module concept that offers available alternatives from SO-DIMM to solder modules.
Two new modules are the beginning
These are two modules from the TX-SODIMM series and two from the QS solder module series. All modules use the Renesas RZ/G2L microprocessor. This contains two Cortex®-A55 CPU cores that can be clocked at up to 1.2 GHz. The A-55 CPU achieves about 20% better processing performance at the same frequency compared to the A53 CPU.
ARM graphics engine and MIPI interface integrated
ARM's Mali-G31 graphics engine is on the processor for graphics display, as well as a video codec (H.264). As a display interface, the modules have a MIPI DSI (4 lanes) interface and, in contrast to many other new processors, also a 24-bit parallel interface. This makes a processor of this performance class special, because especially in the field of industrial displays up to 7 inches, the parallel RGB interface is standard.
Additional Cortex®-M33 CPU core for real-time applications
The RZ/G2L used on the TXRZ module also has an additional Cortex®-M33 core that can handle classic microcontroller tasks such as real-time processing. This eliminates the need for an external microcontroller and reduces the overall cost of the system. Other highlights on the module: 2 x Gbit Ethernet, 2 × CAN (CAN-FD), 2× USB2.0 (host, host/peripheral).
Scalable with predictable long-term availability
Exceptional scalability, comprehensive long-term availability and a wide range of peripheral options have helped TX Series products gain broad acceptance in a wide variety of market segments. Renesas-based modules are designed for at least ten years of availability.
Flexible interchangeability
Ka-Ro's pin- and function-compatible modules give you tremendous flexibility.
Simply exchange them - works upwards as well as downwards compatible. Matching starter kits ensure fast time-to-market.
The technical features of DIMM and solder module at a glance:
|
TXRZ-G2L0 |
TXRZ-G2L1 |
QSRZ-G2L0 |
QSRZ-G2L1 |
Prozessor |
RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55 |
|||
Co-Prozessor |
200 MHz ARM® Cortex®-M33 Core |
|||
GPU |
500-MHz ARM® Mali™-G31 |
|||
Temperature |
-40°C bis 85°C |
|||
Size |
68 x 26 x 4 mm![]() |
27 x 27 x 2.7 mm |
||
Power Supply |
3,3 V bis 5 V |
3,3 V |
||
RAM |
1 GB |
512 MB |
1 GB |
512 MB |
ROM |
4 GB eMMC |
4 GB eMMC |
4 GB eMMC |
4 GB eMMC |
H.264 Video Codec Processor |
• |
• |
• |
• |
24bit-RGB display interface |
• |
• |
• |
• |
MIPI-DSI display interface |
• |
• |
• |
• |
10/100Mbps Ethernet |
1 |
1 |
- |
- |
GB Ethernet RGMII |
1 |
1 |
1 |
1 |
USB |
2 |
2 |
2 |
2 |
UART |
4 |
4 |
3 |
3 |
I²C |
4 |
4 |
3 |
3 |
SPI |
3 |
3 |
2 |
2 |
CAN FD |
2 |
2 |
2 |
2 |
MIPI-CSI Camera Interface |
1 |
1 |
- |
- |
SD – Secure Digital Interface |
2 |
2 |
1 |
1 |
Serial Audio Port |
2 |
2 |
1 |
1 |
Security |
Secure Boot, True RNG, Crypto Engine, JTAG Disable, |