The fast way to HMI +++ i.MX8M KI-Quadcore Power on 29 x 29 mm +++ Form factor COM-HPC - performance up to 300 Watt

i.MX8M KI-Quadcore Power on 29 x 29 mm:
Ka-Ro QSX computer-on-modules for soldering on

More memory, more performance, more intelligence!

The new CoM solder modules of the QSX series from Ka-Ro offer you 3 times "more".

These are equipped with the i.MX8M Mini or with the brand new i.MX8M Plus processor from NXP.

Up to 8 GByte eMMC in the smallest of spaces
As usual with Ka-Ro, these solder modules are also compatible with the existing 27 x 27 mm modules. LPDDR4 RAM is used in the new modules. This means that 2 GBytes of RAM and up to 8 GBytes of eMMC are currently available in the smallest possible space.

Both modules measure 29 mm x 29 mm in a QFN housing with a height of only 2.6 mm. Their compact size makes the modules ideal for use in performance-hungry handheld devices.

The modules have four ARM® Cortex®-A53 cores, which can be clocked at up to 1.6G Hz, and an additional Cortex®-M core. The new solder modules are equipped with a Gbit Ethernet, PCIe, a display interface and many other serial interfaces.

Neural Processor for Advanced Machine Learning
The i.MX8M Plus module also has an NPU (Neural Processing Unit) with 2.3 TOPs, as well as other powerful co-processors. In addition to the NPU, an image signal processor for pre-processing camera signals and the Tensilica HiFi4 DSP are integrated. Furthermore, the Plus module has a USB 3.0 interface, 2 CAN FD and two camera interfaces.

Areas of application
The iMX8 Plus processor is especially suited for machine learning applications such as person and object recognition, industrial image processing, robotics, and speech processing.
The 3D GPU and VPU of both modules enable excellent screen and display performance.

Quick entry with the QBASE3 starter kit
The new QBASE3 starter kit is ideal for a quick introduction to the new CoM series solder module. This is alternatively available in the version with i.MX8M Mini or i.MX8M Plus. Each starter kit has 4 USB, IO header, display connection, two camera connections* and an M.2 socket, connected to the PCIe port for e.g. wireless module 60-2230C from LAIRD Connectivity. WLAN and Bluetooth are then also available. (*second camera interface only with i.MX8M Plus).

Pin compatibility makes integration easy!
The special QS concept allows the use of a simple 2-layer base board - there is no need for an expensive multi-layer board layout. Just like Ka-Ro's TX family, the new family is also based on a pin-compatible concept, so that the required performance is easy to scale.

The optimised pinout is designed to allow direct connections without crossing the tracks. There are no connections for the user under the housing except for the central GND pad. This provides equal, controlled impedances at all connections of the module. In addition, the central GND pad on the bottom of the QSCOM module is divided into sections to improve solder joint reliability and self-alignment.

QFN solder joints save time-consuming X-ray inspection
Thanks to the QFN solder joints, you can dispense with a time-consuming X-ray inspection of the contact, which would be necessary for BGA enclosures, for example. A quick visual inspection is sufficient. All PINs are easy to reach by measurement.

Direct soldering increases operational reliability in harsh environments. In addition, costs are saved because board-to-board connectors can be dispensed with and the modules can be automatically assembled and soldered.

Your path is thus clear for large-scale series production!

Key Features QSXM Serie – QSXM-MM60

• NXP i.MX 8M Mini Quad Cortex-A53
  up to 1.6 GHz
• Cortex-M4 up to 400 MHz
• RAM 2 GB LPDDR4
• ROM 4 GB eMMC
• Grade Industrial
• Temperature -25 °C to 85 °C
• Display support
  • MIPI DSI (4-lane)
  • GC328 2D GPU
  • GCNanoUltra 3D GPU
  • 1080p60 video de-/encode
• Connectivity
  • 2 x USB 2.0
  • 1 x Gb Ethernet, RGMII
  • 1 x eMMC/SD
  • 1 x PCIe® Gen 2 – 1-lane
  • 4 x UART, 3 x I²C, 2 x SPI,
  • 4 x PWM, SAI
  • 1 x MIPI-CSI (4-lane each)
  • Up to 60 x 3.3 V General Purpose I/O

Order designation module: QSXM-MM60

Starterkit: QSXM-SV01

Key Features QSXP Serie – QSXP-ML81

• NXP i.MX 8M Plus Quad Cortex-A53
  up to 1.6 GHz
• Cortex-M7 up to 800 MHz
• RAM 2 GB LPDDR4
• ROM 8 GB eMMC
• Grade Industrial
• Temperature -30 °C to 85 °C
• Display support
  • MIPI DSI (4-lane)
  • GC520L 2D GPU
  • GC7000UL 3D GPU
  • 1080p60 video de-/encode
• Vision and Machine Learning
  • 2 x MIPI-CSI (4-lane each)
  • Dual Camera ISP (2x HD/1x 12MP) HDR, dewarp
  • Machine Learning Accelerator: 2.3 TOPS
  • Tensilica® HiFi4 DSP up to 800 MHz
• Connectivity
  • 1 x USB 3.0, 1 x USB 2.0
  • 1 x Gb Ethernet with IEEE®1588, AVB, TSN
  • 1 x eMMC/SD, 2 x CAN-FD
  • 1 x PCIe® Gen 3 – 1-lane
  • 3 x UART, 2 x I²C, 2 x SPI, PWM, SAI
  • Up to 60 x 3.3 V General Purpose I/O

Order designation module: QSXP-ML81

Starterkit: QSXP-SV01

Take advantage of our more than 20 years of experience and expertise with CoM modules and industrial PCs.
Start your Ka-Ro CoM development with GLYN-SUPPORT now!