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Robust e-MMC family based on BiCS Flash™ 3D:
Leading Edge Technology from the Inventor of Flash


The embedded Multi Media Card (eMMC™) is a very popular storage solution.
It is reliable, easy to integrate and cost-effective.

The inventor of flash technology KIOXIA (formerly TOSHIBA) now presents its new eMMC™ family with the state-of-the-art 3D BiCS Flash™.

In addition to the 2D Flash-based e-MMCs™, the new 3D-based eMMCs™ are an attractive alternative. They score with superior price competitiveness, longevity and faster interface.

Ideal for intensive write-erase cycles
Especially for applications in industrial environments, the eMMC™ is often exposed to intensive write-erase stress and increased temperature conditions. If required, the developer can configure the memory as an "Enhanced User Data Area" via firmware. This enables reliable and long-term secure storage of data in the e-MMC™.

Approach to Single Level Cell technology (SLC)
The JEDEC standardised function is often called "pseudo-SLC mode" or "SLC-Like mode". This configuration of the memory area enables a longevity and robustness that approaches SLC (1bit/cell) memories. For the current MLC (2bit/cell) based eMMCs™ this option has been offered for some time. Now this conversion is also possible for the brand new BiCS Flash™ 3D based eMMCs™, which are factory configured in TLC (3bit/cell).


Easy integration into existing and new designs
Thanks to the JEDEC-compliant product specification, this new generation of eMMCs™ can be easily integrated into existing platforms or new designs. Take advantage of the new cost-effective memory in your memory solution developments. When planning memory size, keep in mind that a pSLC configuration divides the available native memory capacity of the new 3D Flash-based eMMCs™ by three.

Product Features:

  • Interface
    • JEDEC e-MMC 5.1 Standard
  • Capacity – 3D TLC
    • 16 GB, 32 GB, 64 GB, 128 GB
  • Mains voltage
    • 2,7 V bis 3,6 V (Memory core / Vcc)
    • 1,7 V bis 1,95 V (Interface / VccQ)
  • Operating temperature
    • -25 ℃ to +85 ℃
  • Package / Maße
    • 153-ball FBGA 11,5 mm × 13,0 mm × 0,8 mm / bzw. 1,0 mm bei 128 GB

GLYN has the knowledge and resources to successfully support you in the design-in process. Enjoy the benefit of reliable processes when selecting the right eMMC™ and secure expert advice.

Request technical information or order release samples today.
We will be happy to provide you with further information on request

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