Processors for real-time graphics applications +++ Remain deliverable despite allocation! +++ 7-inch display offspring in the TFT family concept

Remain deliverable despite allocation!
Thanks to ARM-Cortex CoM solder module solutions

They are going through this experience right now:
Component procurement is the central issue due to the current allocation situation.
Is the "heart" of your application not available for a very long time?
Then you have to change your design to an alternative processor in no time at all.
But suddenly the main memory also slips onto the list of missing components...

However, you can outsource many sourcing challenges by using parts that already combine many components.

With ARM-Cortex solder modules from Ka-Ro, you remain flexible.

You only need to procure one component, namely the soldering module. This already contains all the essential functional units, such as the processor, working memory (RAM), programme memory (flash) and power management. You do not have to procure all these components individually.

In addition, you as the developer are relieved of the extremely complex core design. The production process is simplified considerably, as you do not have to process complex FBGA components. For example, current processors in the popular i.MX8 series come in 14 × 14 mm FCBGA packages and are clocked at up to 1.8 GHz.

Simple board design

The carrier board to be developed does not require a multilayer design. As a rule, boards with 2 to 4 layers are sufficient.

Currently, many customers have already revised existing designs and are already successfully using Ka-Ros solder modules in practice.