Manufacturer Interview - Allocation and component shortage +++ Smart Embedded - Part 2 +++ Certified 5.2 modules including Bluetooth stack

Bluetooth 5.2 on small 12.9 x 15 x 2.2 mm:
Certified 5.2 modules including Bluetooth stack from SILICON LABS


Pre-programmed Bluetooth modules for the tightest of spaces.

With the BGX220, manufacturer SILICON LABS is expanding its BlueGecko series with certified module variants that have the Bluetooth stack on board.

The BGX220 offers fully upgradeable and robust software stacks. Worldwide pre-certification and advanced development and debugging tools shorten your time-to-market.

Pre-programmed cable replacement firmware on board
Based on the BGM220 modules, the BGX variants have the integrated Bluetooth stack, an Xpress command interface and pre-programmed cable replacement firmware for a Bluetooth 5.2 serial connection of your devices. There is no need for time-consuming firmware development.

Certified hardware platform
An already integrated antenna, RF certifications and built-in cloud connectivity for secure updates via the Xpress framework are further key features of the new BGX series. In summary, the BGX220 module is a certified hardware platform that saves time and costs in developing a Bluetooth connection. The integrated Bluetooth stack allows you to easily connect to your already used MCU. 

Pin-compatible with BGM220 modules
If you want to implement even more functions with the modules in the course of your development: The BGX220 modules are pin-compatible with the BGM220 modules.

BGX220 Features

  • Bluetooth 5.2 RF unit
    Up to +8dBm TX power
  • 1M, 2M and Coded PHY
  • Long range
    Up to 200m line of sight
  • Maximum baud rate: 2M baud
  • Max. Data throughput: 1000 kbit/s
  • UART and I²C interfaces
  • SiP and PCB module available


The new PCB modules are available in a 12.9 x 15.0 x 2.2 mm small PCB package. The PCB variant offers higher RF performance compared to the smaller SiP modules.

  • ARM Cortex-M33 with 76.8 MHz
  • +8 dBm transmit power
  • Up to 512 kB Flash and 32 kB Ram
  • Bluetooth 5.2


The System-in-Package (SiP) module from SILICON LABS is one of the smallest modules available on the market. They are available in a size of only 6.0 x 6.0 x 1.1 mm.

  • ARM Cortex-M33 with a clock rate between 38.4 MHz and 76.8 MHz
  • Up to +6 dBm transmitting power
  • Up to 512 kB Flash and 32 kB Ram
  • Bluetooth 5.2
  • Temperature range from -40 °C to 105 °C
SiP-Module BGM220S

Starter kits for easy entry into the BLE world from SILICON LABS:

BGM220 Module Explorer Kit BGM220-EK4314A

The BGM220 Explorer Kit from Silicon Labs is a low-cost development and evaluation platform for the BGM220P Bluetooth® module in a small form factor. The kit includes a mikroBUS ™ connector and a qwiic connector.

Programming the BGM220 Explorer Kit is easily done via a USB micro-B cable and the integrated J-Link debugger. A virtual USB COM port establishes a serial connection to the target application.

Connecting external hardware to the BGM220 Explorer Kit can be done using the 20 breakout pads. Hardware from the qwiic Connect system can be connected via I2C using the qwiic connector.

Hardware in the form of SoC or modules, as well as the appropriate software stacks and tools.
At SILICON LABS you get everything from a single source.

The revised development environment Simplicity Studio 5 is the central hub for your development. Based on the Eclipse environment, all information and tools are provided here with just a few clicks.

Further information is available on request.

BGM220 Module Explorer Kit BGM220-EK4314A

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