XFMEXPRESS™ - New Embedded and Removable Storage Device:
XFM the new JEDEC standard
The abbreviation XFM stands for Cross (X) Over Flash Memory.
This new flash memory form factor was approved as a new official memory standard in 2021 under the specification "JEDEC XFM Device 1.0".
The inventor of flash technology KIOXIA (formerly TOSHIBA) is now introducing the industry's first XFM memory to the market. The NVMe removable memory with PCIe interface is available with capacities from 128 GB to 1 TB. At 14 × 18 × 1.4 mm (L×W×H), the small memory module is only minimally larger than the universally known microSD card. XFMEXPRESS™ combines the compactness of solderable BGA solutions with the flexibility of M.2 SSDs with PCIe interface. It is aimed at all users who want to take advantage of the compactness of the available BGA SSDs (e.g. from M.2 1620 ICs), but do not want to forego the flexibility of a removable storage medium.
"KIOXIA recognized the need for a new class of removable memory and leveraged its extensive expertise in single-package memory design to develop the XFMEXPRESS™ XT2," commented Axel Stoermann, Vice President of Memory Marketing & Engineering, KIOXIA Europe GmbH. "We plan to continue to innovate and lead the way with more breakthrough memory solutions for complex design challenges."
These are the benefits of the XFM form factor
In the new XFM form factor, a modern combination of features succeeds in revolutionizing ultra-mobile PCs, IoT devices and various embedded applications:
- Groundbreaking serviceability
The XFMEXPRESS™ XT2 enables a new category of compact storage devices that are easy to maintain or upgrade. By combining a rugged, small package with removable storage functionality and flexibility, the XFMEXPRESS™ XT2 helps eliminate previous technical barriers or design constraints.
- Mobile-Friendly Footprint
The form factor's small size and low profile (14mm x 18mm x 1.4mm) provides a footprint of 252 mm2. This optimizes the mounting space for ultra-compact host devices in terms of performance or serviceability. With this minimized height, the XFMEXPRESS™ XT2 form factor is ideal for thin and lightweight applications, creating new design opportunities for next-generation applications and systems. This solution takes up only 22.2 mm x 17.75 mm x 2.2 mm of space when the storage medium and connector are taken into account. For comparison - the smallest removable media with PCIe / NVMe interface available on the market so far, a CFexpress® card, had an area about 5 times larger (1147.3 mm²) !
The XFMEXPRESS™ XT2 is designed for speed and implements a PCIe 4.0 x 2 lanes, NVMe 1.4b interface. The XFMEXPRESS™ XT2's industry-leading performance and rugged form factor provide a compelling alternative to other SSD form factors, enabling superior computing and user experiences.
KIOXIA showcased its XT2 solution in June at Embedded World 2022 in Nuremberg, Germany. What this means for you: less space required for even faster storage - flexibly exchangeable or expandable.
Sampling available now!
The new KIOXIA XFMEXPRESS™ XT2 is now sampling. Request technical information or order release samples today.
We will be happy to provide you with further information upon request.
 As of June 2022, compared to other PCIe NVMe form factors.
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