Smart Embedded - Part 3:
Design your own Smart Embedded® Display
Smart Embedded® displays come with a range of industrial interfaces - ideal for a quick start in the development. But what if you have additional wishes, such as an SD card, an isolated CAN transceiver or more UARTs? That is also possible!
In addition to using our standard Smart Embedded® displays as a proof-of-concept, they are also ready to be used for mass production.The GPIOs offer alternative functions and an extension connector gives access to additional interfaces. For example, you can develop your own extension board and test it extensively. To finalise the product for mass production we offer two options:
- We adapt the Smart Embedded® Display for you (fitting additional components).
- We assemble a connector of your choice so that you can apply an expansion board.
Put the "tiger" on the board:
performance enhancement with Tiger-Lake processors
New from Intel are the 11th generation Tiger-Lake processors.
These are the successors of the well-known Comet-Lake (10th generation Intel® Core™).
The manufacturer is upgrading with performance growth against the AMD Ryzen processors.
The 11th generation processors, manufactured in 10 nm microarchitecture, come with up to 25% more performance compared to their predecessors, as well as almost 3 times the graphics performance. All this with very low power consumption.
Exact range measurement from 4 cm to 5 m:
TDK MEMS ultrasonic time-of-flight sensors
TDK Chirp Microsystems has developed a high-quality 3D sensor technology. This is based on the sonar principle from the animal world and combines it with Time-of-Flight (ToF) sensor technology.
The ToF ultrasonic sensors CH101 and CH201 are designed in a 3.5 x 3.5 x 1.26 mm 8-pin LGA package. The manufacturer combines a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with a power-efficient digital signal processor (DSP) ASIC.
In the industry, these are currently the only MEMS-based sonars on a chip the size of a mm.
Only 1 µA standby current:
New DC motor driver extends battery life
TOSHIBA's TB67H450FNG and TB67H451FNG are single-channel H-bridge drivers for brushed DC motors. They drive motors from 4.5V to 50V with a maximum current of 3.5A.
The devices have the industry's lowest standby current of only 1µA over their entire voltage and temperature range. This is a factor of 10 lower than the well-known competitors.
This makes them ideal for all applications that draw their power from a battery or accumulator. Battery life is extended. Replacement costs are reduced. For battery-powered devices, charging is reduced.
Design-In Memory for the Industry:
Wide Choice from Legacy to Leading Edge Technologies
From SDRAM, DDR, DDR2, DDR3 to DDR4.
Reliable RAM has been a "speciality" of ours for over 40 years.
Will the manufacturers ATP, KINGSTON and Xmore®, we offer you an almost complete industrial portfolio from robust legacy to high-performance leading edge technology
Xmore® Memories technically and optically customised:
Tailor-made industrial solutions
Industrial storage media from Xmore® differ from other products on the storage market. They can be customised both technically and optically.
We fulfil our customers' wishes for precisely fitting industrial storage media with our house brand Xmore®.
"Xmore® memories have been proving their worth in industry for over 30 years. Customised storage solutions according to customer specifications are our speciality. Only components configured according to strict industrial standards are used," says Sebastian Stricker, Product Manager Xmore® and Team Leader Product Management Industrial Storage Media at GLYN, explaining the strategy for Xmore.
GLYN-Talk - Topic of the month:
Low-voltage MOSFETs - Really "cool" types with more power
New enclosures improve cooling and increase reliability
More power, less heat. These "guys" just stay "cool". TOSHIBA's U-MOS IX-H and X-H MOSFETs are highly efficient components for DC-DC converters, power supplies, chargers, BLDC motor controllers. They achieve excellent efficiencies. New packages improve cooling and increase reliability. The components are specified for applications up to 175 °C. Find out in our GLYN Talk which "cool" types you should go for.
Learn all about our sourcing service in our GLYN-Talk module POW-001.