High capacity meets high speed:
32-Terabyte U.2 Solid State Drive (SSD) with PCIe Gen 3x4 interface
A container ship with a huge capacity as fast as a high-speed train.
This is our Xmore® U.2 SSD with a PCIe interface and a 2.5" form factor.
32-terabyte capacity with a transfer rate of 1.2 GB/s.
Increasing numbers of devices are designed for high data volumes.
Processing this immense amount of data, however, is anything but easy. It is essential that you not only increase the memory capacity but also scale up the bandwidth. Only then can you set the right the course for smooth interaction in your application.
Higher storage density, thanks to BiCS FLASH™ 3D technology:
KIOXIA e-MMC for industry
The demand for higher storage capacities is growing in all segments of the consumer and industrial markets. The demand for cost-optimised and technologically optimised storage solutions for the continuous development of competitive products is also increasing.
KIOXIA, formerly TOSHIBA Memory, is now offering its BiCS FLASH™ 3D flash memory technology in its e-MMC memory systems. Executed in the reliable charge trap cell structure, you obtain a cost-effective industrial solution for the JEDEC-standardised interface with long-term availability.
BiCS FLASH™ efficiently stores high data volumes
We all know the problem.
A vast selection of off-the-peg clothing… but it doesn't fit perfectly in the vast majority of cases. Expensive alterations are required to make the purchased garment fit just the way you have in mind.
The same applies to memories.
The choice of products is enormous. Except they are not tailored to the requirements and specifications of your application in most cases.
Speed, speed and even more speed…
High-speed data processing, real-time analysis and data-driven decision-making. These are just some of the many characteristics of a changing industrial world.
The fastest DDR4 modules of the 3200 series from ATP take computing power to a new speed level:
Touch operation, voice recognition, image processing in IoT devices for automotive, industry and Smart Home.
Easy to integrate in the board thanks to fewer pins, HyperRAM provides low power consumption and simple control of the peripherals. It works well together with the higher performance and lower power consumption of modern MCUs. This considerably enhances the performance and efficiency of mobile terminal devices.
As a pioneer of this technology, CYPRESS is extending its HyperBus Memory portfolio.