Ideal in IoT applications with a graphical user interface:
HyperRAM™ 2.0 MEMORY ensures immediate function
Touch operation, voice recognition, image processing in IoT devices for automotive, industry and Smart Home.
Easy to integrate in the board thanks to fewer pins, HyperRAM provides low power consumption and simple control of the peripherals. It works well together with the higher performance and lower power consumption of modern MCUs. This considerably enhances the performance and efficiency of mobile terminal devices.
As a pioneer of this technology, CYPRESS is extending its HyperBus Memory portfolio.
HyperRAM™ 2.0 has enabled the manufacturer to establish a dynamic high-speed RAM (DRAM) with a low pin count and self-refresh with a capacity of up to 128 Mbit.
This memory is ideal as an extended memory for embedded systems. HyperRAM™ 2.0 offers a HyperBus interface and now a new Octal SPI interface.
You can quickly and cost-effectively optimise your design and system.
The CYPRESS HyperRAM™ memory is a self-refresh DRAM. The 24-pin HyperBus interface works with double data rate (DDR) and can scale a throughput of up to 400 MByte/s.
This makes it the ideal extended memory for controllers with limited on-board RAM.
When used as a "notepad memory", high-resolution graphics are provided immediately at the beginning of the start-up process, thanks to high-speed reading and writing. Furthermore,
the power consumption is considerably reduced in sleep mode.
Areas of application
HyperRAM™ 2.0 Memory is the ideal memory for motor vehicle instrument clusters, industrial HMI, IoT applications and industrial image processing and display systems for consumer electronics.
- JEDEC Expanded SPI (xSPI) – compatible with most controllers and memories
- Bandwidth of up to 400 MByte/s (3200 Mbit/s)
- Capacities from 64 Mbit to 128 Mbit
- Operating voltage range 1.7 – 2.0 V and 2.7 – 3.6 V
- Temperature ranges:
Industry (-40 °C to 85 °C), Industry Plus (-40 °C to 105 °C), Automotive Grade 3
(-40 °C to 85 °C) and Automotive Grade 2 (-40 °C to 105 °C)
- AEC-Q100 certified
- Smallest available 24-ball BGA housing, 6 mm x 8 mm
- Low active power consumption
The video here shows you how HyperRAM™ 2.0 works:
Further technical information and release samples are available on request.